At IEDM 2021, Intel revealed a host of new statements that
will force and accelerate Moore's Law Beyond 2025. These advancements range
from integrating quantum physics discoveries, new packaging and transistors
technologies & much more.
Intel's Post-2025 Moore's Law Ambitions: Deliver More
Transistors, Bring New Silicon Capabilities, Embrace The Quantum Realm
What’s New: In its relentless quest of Moore’s Law, Intel is
unveiling significant packaging, transistor, and quantum physics inventions
fundamental to advancing and accelerating computing well into the upcoming
decade. At IEEE International Electron Devices Meeting (IEDM) 2021, Intel
defined its path toward more than 10x interconnect density development in
packaging with hybrid bonding, 30% to 50% area upgrading in transistor scaling,
major developments in new power and memory technologies, and new theories in
physics that may one day revolutionize computing.
“At Intel, the research and advancement necessary for accelerating Moore’s Law never halts. Our Components Research Group is sharing vital research innovations at IEDM 2021 in bringing revolutionary process and packaging technologies to meet the limitless demand for powerful computing that our industry and society depend on. This is the outcome of our best scientists’ and engineers’ determined work. They continue to be at the front of innovations for continuing Moore’s Law.”
–Robert Chau, Intel Senior Fellow and general manager of Components Research
Why It Matters: Moore’s Law has been tracing innovations in calculating
that meet the demands of every technology generation starting from mainframes
to cell phones. This evolution is continuing today as we move into a new generation
of working out with unlimited data and artificial intelligence.
Constant innovation is the foundation of Moore’s Law.
Intel’s Components Research Group is dedicated to innovating across three key
areas: vital scaling technologies for providing more transistors; new silicon
capabilities for power and memory gains; and study of new concepts in physics
to revolutionize the way the world undergoes computing. Many of the inventions
that broke through former barriers of Moore’s Law and are in today’s products
started with the work of Component Research – with strained silicon, Hi-K metal
gates, FinFET transistors, RibbonFET, packaging innovations and EMIB and
Foveros Direct.
How We Are Doing It: The innovations revealed at IEDM 2021 reveal
Intel is on track to continue the improvement and benefits of Moore’s Law well
beyond 2025 through its three areas of pathfinding.
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